Smart connection
Computers could soon quadruple in speed, thanks to flowfill, a new way of manufacturing silicon chips. Plasma and Materials Technology, a New York-based company, claims to have found a method of increasing the amount of insulation between the microscopic wires that make up a computer chip. It will thus be possible to shrink their designs and increase the number of wires they use. Traditionally silicon-chip manufacturers use gases containing silicon dioxide to create insulation between a chip's circuits. When heat is applied to the chip, the gas hardens and forms an insulating covering. The new method applies the insulation when the gas is in a liquid state.
Related Content
- Unlocking smart grid opportunities in emerging markets and developing economies
- How safe are drinking water services in rural India?
- Measuring and monitoring progress towards the Sustainable Development Goals
- Quality infrastructure for smart mini-grids
- Feeling Safe in the Home of the Future: A product life-cycle approach to improve the trustworthiness of smart home products and services
- Enabling data-sharing: emerging principles for transforming urban mobility